Cold Mounting Compound
Cold mounting is typically used for mounting specimens that are sensitive to high temperature and high pressure.
Product Introduction
Cold mounting is typically used for mounting specimens that are sensitive to high temperature and high pressure.
The cold-mounting series comprehensively meets diverse application requirements, including rapid curing, high hardness, bubble-free performance, and complete transparency.
Cold mounting materials are primarily composed of environmentally friendly epoxy or acrylic resins, which are non-toxic, harmless, easy and quick to use, and cost-effective.
Buying Guide
|
Name |
Model |
Packaging |
Application |
|
Cold-Inlaid King |
LYK |
1,000 grams of cold-setting powder, 800 ml of curing agent, one φ30 cold-inlay mold, 20 plastic cups, 40 stirring rods, and one spoon. |
The product features fast embedding, good transparency, low viscosity, and high strength. It is suitable for the metalworking industry where no heating, no pressure, and no embedding equipment are required. Curing time: 25°C, 25 minutes Weight ratio: cold-setting powder 5 : curing agent 4 |
|
Epoxy King |
HSK |
1000 ml of resin liquid, 500 ml of curing agent, one φ30 cold mounting mold, 20 plastic cups, and 40 stirring rods. |
The product cures rapidly and is completely transparent. It is suitable for mounting samples that cannot be heated, as well as for microsectioning of PCBs, SMT assemblies, and other electronic components where no mounting equipment is available. Curing time: 25°C, 1 hour Weight ratio: resin liquid 2 : curing agent 1 |
|
HSN |
1000 ml of resin liquid, 500 ml of curing agent, one φ30 cold mounting mold, 20 plastic cups, and 40 stirring rods. |
The product features low viscosity, excellent permeability, and complete transparency. It is suitable for mounting microsections of samples that cannot be heated or for which no mounting equipment is available, such as PCBs and SMT components. Curing time: 25°C, 3–4 hours Weight ratio: resin liquid 2 : curing agent 1 |
|
|
HSM |
1000 ml of resin liquid, 300 ml of curing agent, one φ30 cold mounting mold, 20 plastic cups, and 40 stirring rods. |
The product generates little heat, exhibits minimal shrinkage, and is completely transparent. It is suitable for mounting microsection samples in applications where the specimen cannot be mounted or where no mounting equipment is available, such as PCBs and SMT assemblies. Curing time: 25°C, 20–24 hours Weight ratio: resin liquid 3 : curing agent 1 |
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